Chip Failure Analysis (FA)
Chip Failure Analysis (FA) is a critical discipline for ensuring product reliability and improving yield. Faced with challenges like functional failure, short circuits, leakage, or batch failures, HyperSemi delivers comprehensive root-cause analysis solutions. Leveraging a systematic approach, state-of-the-art equipment, and a team of seasoned experts, we help clients pinpoint design flaws, process issues, and application faults, enabling rapid problem closure and product enhancement.
2026-01-31
芯片CP测试服务
这家最先进的莫霍克谷工厂是世界上第一家专门建造的全自动200毫米碳化硅工厂,与Wolfspeed市场领先的200毫米材料生产相结合,巩固了Wolfspeed作为唯一一家完全垂直整合的200毫米碳化硅制造商的竞争地位。
2024-08-31
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